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 HAT2085T
Silicon N Channel MOS FET High Speed Power Switching
REJ03G0163-0500 Rev.5.00 Nov 27, 2007
Features
* Low on-resistance * Low drive current * High density mounting
Outline
RENESAS Package code: PTSP0008JB-B (Package name: TSSOP-8 )
5678 DD DD
87
65 34
4G
12
1, 2, 3 4 5, 6, 7, 8
Source Gate Drain
SSS 123
Absolute Maximum Ratings
(Ta = 25C)
Item Drain to source voltage Gate to source voltage Drain current Drain peak current Body to drain diode reverse drain current Channel dissipation Channel temperature Storage temperature Symbol VDSS VGSS ID ID (pulse) Note 1 IDR Pch Note 2 Tch Tstg Value 200 30 1.4 11.2 1.4 1.3 150 -55 to +150 Unit V V A A A W C C
Notes: 1. PW 10 s, duty cycle 1% 2. When using the glass epoxy board (FR4 40 x 40 x 1.6 mm), PW 10 s
REJ03G0163-0500 Rev.5.00 Nov 27, 2007 Page 1 of 6
HAT2085T
Electrical Characteristics
(Ta = 25C)
Item Drain to source breakdown voltage Gate to source leak current Zero gate voltage drain current Gate to source cutoff voltage Static drain to source on state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge Gate to source charge Gate to drain charge Body to drain diode forward voltage Body to drain diode reverse recovery time Note: 3. Pulse test Symbol V (BR) DSS IGSS IDSS VGS (off) RDS (on) |yfs| Ciss Coss Crss td (on) tr td (off) tf Qg Qgs Qgd VDF trr Min 200 -- -- 3.0 -- 1.0 -- -- -- -- -- -- -- -- -- -- -- -- Typ -- -- -- -- 0.49 1.7 300 43 12 21 11 48 18 10 1.8 4.8 0.8 65 Max -- 0.1 1 4.5 0.64 -- -- -- -- -- -- -- -- -- -- -- 1.2 -- Unit V A A V S pF pF pF ns ns ns ns nC nC nC V ns Test Conditions ID = 10 mA, VGS = 0 VGS = 30 V, VDS = 0 VDS = 200 V, VGS = 0 ID = 1 mA, VDS = 10 V ID = 0.7 A, VGS = 10 V Note 3 ID = 0.7 A, VDS = 10 V Note 3 VDS = 25 V VGS = 0 f = 1 MHz VDD 100 V, ID = 0.7 A VGS = 10 V RL = 143 Rg = 10 VDD = 160 V VGS = 10 V ID = 1.4 A IF = 1.4 A, VGS = 0 Note 3 IF = 1.4 A, VGS = 0 diF/dt = 100 A/s
REJ03G0163-0500 Rev.5.00 Nov 27, 2007 Page 2 of 6
HAT2085T
Main Characteristics
Power vs. Temperature Derating
2.0
Maximum Safe Operation Area
100
10 s
1
Pch (W)
ID (A)
Test Condition: When using the glass epoxy board (FR4 40 x 40 x 1.6 mm), PW 10 s
10
m
PW
1.5
10
s
0
s
Channel Dissipation
1
Drain Current
1.0
DC
=
Op
10
er
m
0.1
at
ion
s
0.5
Operation in W No this area is 10 te s) 4 0.01 limited by RDS (on) Ta = 25C 1shot pulse
(P
0
0
50
100
150
200
0.001 0.1
1
10
100
1000
Ambient Temperature
Ta (C)
Drain to Source Voltage
Note 4: When using the glass epoxy board (FR4 40 x 40 x 1.6 mm)
VDS (V)
Typical Output Characteristics
10
Pulse Test 10 V 8V 7V
Typical Transfer Characteristics
10
VDS = 10 V Pulse Test
(A)
(A) ID Drain Current
6V
8
8
ID
6
6
Drain Current
4
4
Tc = 75C
2
5V VGS = 4.5 V
2
25C
-25C
0 0 4 8 12 16 20
0 0 2 4 6 8 10
Drain to Source Voltage
VDS (V)
Gate to Source Voltage
VGS (V)
Drain to Source Saturation Voltage vs. Gate to Source Voltage
Drain to Source on State Resistance RDS (on) ()
Static Drain to Source on State Resistance vs. Drain Current
10
VGS = 10 V 5 Pulse Test
Drain to Source Saturation Voltage VDS (on) (V)
2.0
Pulse Test
1.5
2 1 0.5
1.0
ID = 1.4 A
0.5
1.0 A 0.5 A
0.2 0.1 0.1 0.2 0.5 1
0 0 5 10 15 20
2
5 10 20
50 100
Gate to Source Voltage
VGS (V)
Drain Current
ID (A)
REJ03G0163-0500 Rev.5.00 Nov 27, 2007 Page 3 of 6
HAT2085T
Static Drain to Source on State Resistance vs. Temperature
Forward Transfer Admittance |yfs| (S)
2.0 VGS = 10 V Pulse Test 1.5 ID = 1.4 A 1.0 10 5 VDS = 10 V Pulse Test Tc = -25C
Static Drain to Source on State Resistance RDS (on) ()
Forward Transfer Admittance vs. Drain Current
2 1 0.5 0.2 0.1 0.1 75C
25C
0.5
0.5 A
0 -25
0
25
50
75
100 125 150
0.2
0.5
1
2
5
10
Case Temperature
Tc
(C)
Drain Current ID (A) Typical Capacitance vs. Drain to Source Voltage
1000 500 Ciss
Body to Drain Diode Reverse Recovery Time
1000
Reverse Recovery Time trr (ns)
500
Capacitance C (pF)
200 100 50 20 10 5 2 1 0 VGS = 0 f = 1 MHz 20 40 60 80 100 Crss Coss
200 100 50
20 10 1
di / dt = 100 A / s VGS = 0, Ta = 25C 10 100 1000
Reverse Drain Current
IDR (A)
Drain to Source Voltage VDS (V)
Dynamic Input Characteristics
VDS (V)
ID = 2 A
Switching Characteristics
VGS (V)
16 1000 VGS = 10 V, VDD = 100 V PW = 5 s, duty 1 % 300 Rg = 10 100 30 10 3 1 0.1 0.2 tf td(off) td(on) tf tr
400
VGS 12 VDD = 50 V 100 V 160 V
300
Drain to Source Voltage
200
VDS
8
Gate to Source Voltage
Switching Time t (ns)
100
VDD = 160 V 100 V 50 V 0 4 8 12 16 20
4
tr
0
0
0.5
1
2
5
10
20
Gate Charge
Qg (nc)
Drain Current
ID (A)
REJ03G0163-0500 Rev.5.00 Nov 27, 2007 Page 4 of 6
HAT2085T
Reverse Drain Current vs. Source to Drain Voltage
10
Gate to Source Cutoff Voltage VGS (off) (V)
Gate to Source Cutoff Voltage vs. Case Temperature
5
ID = 10 mA
Reverse Drain Current IDR (A)
Pulse Test
8
4
1 mA
6
3
0.1 mA
4
10 V VGS = 0
2
2
5V
1
VDS = 10 V
0 0 0.4 0.8 1.2 1.6 2.0
0 -25
0
25
50
75
100 125 150
Source to Drain Voltage
VSD (V)
Case Temperature
Tc (C)
Normalized Transient Thermal Impedance vs. Pulse Width
Normalized Transient Thermal Impedance s (t)
10
1
D=1 0.5
0.2
0.1
0.1
0.05
0.02
0.01
0.01
ch - f (t) = s (t) * ch - f ch - f = 139C/W, Ta = 25C When using the glass epoxy board (FR4 40 x 40 x 1.6 mm)
PDM
D= PW T
0.001
1s
0.0001 10
t ho
pu
lse
PW T
100
1m
10 m
100 m
1
10
100
1000
10000
Pulse Width PW (s)
Switching Time Test Circuit
Switching Time Waveform
Vin Monitor
10
Vout Monitor D.U.T. RL
90% 10% 10% 10%
Vin Vout
Vin 10 V
VDD = 100 V
90% td(on) tr
90% td(off) tf
REJ03G0163-0500 Rev.5.00 Nov 27, 2007 Page 5 of 6
HAT2085T
Package Dimensions
Package Name TSSOP-8
JEITA Package Code P-TSSOP8-4.4 x 3-0.65
RENESAS Code PTSP0008JB-B
Previous Code TTP-8DV
MASS[Typ.] 0.037g
8
5
bp
*2 E HE
Index mark
F
*1 D
1
Z
4
*3 b p
Terminal cross section NOTE) 1. DIMENSIONS "*1(Nom)" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET.
xM
(Ni/Pd/Au plating)
e
c
Reference Symbol
Dimension in Millimeters
Min
L1
L
D E A2 A1 A bp b1 c c1 HE e x y Z L L1
Nom Max 3.00 3.30 4.40
A
0.03 0.07 0.10 1.10 0.15 0.20 0.25 0.10 0.15 0.20
A1
y
Detail F
0 8 6.20 6.40 6.60 0.65 0.13 0.10 0.805 0.40 0.50 0.60 1.0
Ordering Information
Part No. HAT2085T-EL-E Quantity 3000 pcs Taping Shipping Container
REJ03G0163-0500 Rev.5.00 Nov 27, 2007 Page 6 of 6
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Notes: 1. This document is provided for reference purposes only so that Renesas customers may select the appropriate Renesas products for their use. Renesas neither makes warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property rights or any other rights of Renesas or any third party with respect to the information in this document. 2. Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising out of the use of any information in this document, including, but not limited to, product data, diagrams, charts, programs, algorithms, and application circuit examples. 3. You should not use the products or the technology described in this document for the purpose of military applications such as the development of weapons of mass destruction or for the purpose of any other military use. When exporting the products or technology described herein, you should follow the applicable export control laws and regulations, and procedures required by such laws and regulations. 4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and application circuit examples, is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas products listed in this document, please confirm the latest product information with a Renesas sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas such as that disclosed through our website. (http://www.renesas.com ) 5. Renesas has used reasonable care in compiling the information included in this document, but Renesas assumes no liability whatsoever for any damages incurred as a result of errors or omissions in the information included in this document. 6. When using or otherwise relying on the information in this document, you should evaluate the information in light of the total system before deciding about the applicability of such information to the intended application. Renesas makes no representations, warranties or guaranties regarding the suitability of its products for any particular application and specifically disclaims any liability arising out of the application and use of the information in this document or Renesas products. 7. With the exception of products specified by Renesas as suitable for automobile applications, Renesas products are not designed, manufactured or tested for applications or otherwise in systems the failure or malfunction of which may cause a direct threat to human life or create a risk of human injury or which require especially high quality and reliability such as safety systems, or equipment or systems for transportation and traffic, healthcare, combustion control, aerospace and aeronautics, nuclear power, or undersea communication transmission. If you are considering the use of our products for such purposes, please contact a Renesas sales office beforehand. Renesas shall have no liability for damages arising out of the uses set forth above. 8. Notwithstanding the preceding paragraph, you should not use Renesas products for the purposes listed below: (1) artificial life support devices or systems (2) surgical implantations (3) healthcare intervention (e.g., excision, administration of medication, etc.) (4) any other purposes that pose a direct threat to human life Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who elect to use Renesas products in any of the foregoing applications shall indemnify and hold harmless Renesas Technology Corp., its affiliated companies and their officers, directors, and employees against any and all damages arising out of such applications. 9. You should use the products described herein within the range specified by Renesas, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or damages arising out of the use of Renesas products beyond such specified ranges. 10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other applicable measures. Among others, since the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. 11. In case Renesas products listed in this document are detached from the products to which the Renesas products are attached or affixed, the risk of accident such as swallowing by infants and small children is very high. You should implement safety measures so that Renesas products may not be easily detached from your products. Renesas shall have no liability for damages arising out of such detachment. 12. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written approval from Renesas. 13. Please contact a Renesas sales office if you have any questions regarding the information contained in this document, Renesas semiconductor products, or if you have any other inquiries.
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology (Shanghai) Co., Ltd. Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120 Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7858/7898 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2377-3473 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 3518-3399 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
http://www.renesas.com
Renesas Technology Malaysia Sdn. Bhd Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510
(c) 2007. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .7.2


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